gensys RF board design flow
文件大小: 1631k
源码售价: 10 个金币 积分规则     积分充值
资源说明:Trends • More complex multilayer, multifunctional RF boards • Higher integration of different technologies like RF and Multichip Modules (MCM), die-in-board,... • 3D Stacking of board laminates with Multichip Modules and RF wireless technologies
本源码包内暂不包含可直接显示的源代码文件,请下载源码包。